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MEIE-UPMIT’25

Integrated Circuits Reliability: Test, Simulation, Modeling and Design

The development of integrated circuits has gone through three processes: usable--usable and with good performance--usable and with good performance and high reliability. China has just entered the third process. In the market competition with foreign IC (Integrated Circuits) products, reliability is the short board of domestic IC products, especially in the high stability and reliability of the chip.

Reliability is an important aspect in the development of integrated circuits. If reliability is poor, no product can survive in the market. IC reliability is mainly categorized into aging reliability and disposable reliability. Aging reliability focuses on the aging of integrated circuits and chips due to the process of use. The rate of aging is related to the type of IC, usage conditions, material and process. The aging rate of silicon process chips is relatively slow with more than 10 years’ lifetime. Disposable reliability is concerned with soft or hard damage due to environmental factors.

Electromagnetic compatibility (EMC) is the most common disposable reliability issue (approximately 70%) in the electronic products we use every day. EMC is radiated and contact. There are 4 standards for contact EMC: ESD, EFT, Surge, and ISO. These standards occur for different reasons, produce different pulse shapes, and have different destructive capabilities. How to design an effective EMC protection scheme becomes a very critical technical requirement for the present and future development of integrated circuits.

Convener

Juin J. Liou
Chair Professor and Director of Microelectronics and Solid State Electronic Devices Research Center of North Minzu University, China, National High-level Talent Expert, Chang Jiang Scholar Endowed Professor of the Ministry of Education, Overseas Renowned Teacher of the Ministry of Education, Academician of the National Academy of Innovation of the United States, Academician of Singapore Institute of Manufacturing Technology, Fellow of IEEE, Fellow of IET, Fellow of AAIA.

Biography: Prof. Juin J. Liou is one of the international authorities on IC reliability and a pioneer in the field of electrostatic protection in China. Over the past 30 years, he has devoted himself to scientific research and teaching to enhance the reliability of integrated circuits, established the first batch of electrostatic protection laboratories in China, and trained many related professionals.

Professor Liou has received several honors from the IEEE, one of the world's most influential electrical and electronic engineering societies, for his significant contributions to research and teaching in the field of integrated circuits, including the IEEE Fellowship, the IEEE Distinguished Lecturer, the IEEE Region III Outstanding Engineering Educator Award, and the IEEE Electron Devices Society's Outstanding Education Award. Professor Liou was the only owner of these two awards in the world in that year.

Prof. Liou has authored 13 monographs, published more than 650 academic papers, holds more than 20 patents, and has served as guest editor of numerous journals and chair of more than 50 international conferences.

Session Chairs

Shengjun Zhou
Professor of Wuhan University, China; National "Ten Thousand People Program" for Young Top Talents, Elsevier China Highly Cited Scholar

Biography: Shengjun Zhou received the Ph.D. degree from Shanghai Jiao Tong University, Shanghai, China, in 2011. He is a Professor at Wuhan University. His current research interests lie in the areas of GaN-based LEDs, photonics and semiconductors, nanoimprint lithography and direct laser writing with applications in electronic and photonic devices. He is well known as an industrial technologist. Prior to joining Wuhan University, he was a CTO at Quantum Wafer Inc. from 2011 to 2014, focusing on the development of high brightness GaN-based LEDs. He was a research fellow at University of Michigan, Ann Arbor, from 2014 to 2015. He received many academic awards including the National Youth Talent Support Program, IAAM Scientist Medal, Fellow of IAAM, Fellow of VEBLEO, IOP Publishing Outstanding Reviewer Award, IOP Publishing CHINA TOP CITED PAPER AWARD, distinguished Young Scholar of Hubei province, and Chutian Scholar of Hubei province. He has published more than 92 papers and holds over 36 patents. He is Co-chair of the Organizing Committee for IEEE ICEPT 2016 conference. He served as committee member for many conferences.

Speakers

Kang Liu
Professor of Harbin Institute of Technology (HIT)

Biography: Kang Liu is a professor and doctoral supervisor at Harbin Institute of Technology. He is mainly engaged in diamond crystal growth, diamond detectors, diamond color-centered fluorescence modulation, diamond microwave power devices, and diamond surface state related research, and has presided over two National Natural Science Foundation of China, Key Basic Research Projects of National Ministries and Commissions, Heilongjiang Outstanding Youth Fund, and Heilongjiang Key Research and Development Program, etc. He has published more than 40 SCI papers in AM, AFM, Carbon, APL and other journals, and served as a young editorial board member of Functional Diamond, Journal of Artificial Crystals, China Surface Engineering, and Journal of Materials Protection. He was awarded the second prize of National Technical Invention, the first prize of Heilongjiang Provincial Scientific and Technological Invention, China Patent Prize Award and Heilongjiang Provincial Patent Gold Award.

Zhengwei Fan
National University of Defense Technology (NUDT)

Biography: Zhengwei Fan, received the B.S. degree in mechanical engineering from Xiamen University(XMU) in 2015, and received M.S. degree & Ph.D. degree in mechanical engineering from National University of Defense Technology(NUDT) in 2017 and 2022, respectively. He is now a lecturer at NUDT. His research interests include the microelectronics reliability, reliability testing and evaluation of microstructure and microsystem, fatigue and fracture, fatigue of composite materials.

MEIE 2025

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