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MEIE-UPMIT’25

Integrated Circuits Reliability: Test, Simulation, Modeling and Design

The development of integrated circuits has gone through three processes: usable--usable and with good performance--usable and with good performance and high reliability. China has just entered the third process. In the market competition with foreign IC (Integrated Circuits) products, reliability is the short board of domestic IC products, especially in the high stability and reliability of the chip.

Reliability is an important aspect in the development of integrated circuits. If reliability is poor, no product can survive in the market. IC reliability is mainly categorized into aging reliability and disposable reliability. Aging reliability focuses on the aging of integrated circuits and chips due to the process of use. The rate of aging is related to the type of IC, usage conditions, material and process. The aging rate of silicon process chips is relatively slow with more than 10 years’ lifetime. Disposable reliability is concerned with soft or hard damage due to environmental factors.

Electromagnetic compatibility (EMC) is the most common disposable reliability issue (approximately 70%) in the electronic products we use every day. EMC is radiated and contact. There are 4 standards for contact EMC: ESD, EFT, Surge, and ISO. These standards occur for different reasons, produce different pulse shapes, and have different destructive capabilities. How to design an effective EMC protection scheme becomes a very critical technical requirement for the present and future development of integrated circuits.

MEIE-ICR’25 Session Chair

Juin J. Liou
Chair Professor and Director of Microelectronics and Solid State Electronic Devices Research Center of North Minzu University, China, National High-level Talent Expert, Chang Jiang Scholar Endowed Professor of the Ministry of Education, Overseas Renowned Teacher of the Ministry of Education, Academician of the National Academy of Innovation of the United States, Academician of Singapore Institute of Manufacturing Technology, Fellow of IEEE, Fellow of IET, Fellow of AAIA.

Biography: Prof. Juin J. Liou is one of the international authorities on IC reliability and a pioneer in the field of electrostatic protection in China. Over the past 30 years, he has devoted himself to scientific research and teaching to enhance the reliability of integrated circuits, established the first batch of electrostatic protection laboratories in China, and trained many related professionals.

Professor Liou has received several honors from the IEEE, one of the world's most influential electrical and electronic engineering societies, for his significant contributions to research and teaching in the field of integrated circuits, including the IEEE Fellowship, the IEEE Distinguished Lecturer, the IEEE Region III Outstanding Engineering Educator Award, and the IEEE Electron Devices Society's Outstanding Education Award. Professor Liou was the only owner of these two awards in the world in that year.

Prof. Liou has authored 13 monographs, published more than 650 academic papers, holds more than 20 patents, and has served as guest editor of numerous journals and chair of more than 50 international conferences.

MEIE-ICR’25 Speakers

Coming soon…

MEIE 2025

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